Functional resin materials: heat-dissipating urethane, biomass-modified imide, shielded conductive.
Functional Material Solutions
Exhibited Products at the 40th NePCON Japan Electronics Development and Implementation Exhibition 【Siloxane-Free Thermal Conductive Urethane Paste】Designed for a maximum of 13 W/m·K, it addresses issues related to heat dissipation performance degradation due to poor adhesion between sheet materials and heat dissipation components, as well as contact failures caused by low molecular weight siloxane gases, thereby solving thermal management challenges for electronic components. 【Epoxy Curing Modified Imide Resin】Features such as biomass compatibility and low-temperature curing help reduce environmental impact and production costs. 【Urethane-Based Flexible Conductive Coating】A surface heating paint with shielding functionality made from carbon-based fillers and urethane. ● For more details on each product, please visit our booth.
- Company：大日精化工業
- Price：Other
